Build versatility, efficiency and reliability into your network with the Broadband Connectivity System II (BCS II), Telect's unique modular solution for DS3 connectivity. The cost-effective BCS II offers the optimum blend of high density (up to 32 T3/E3s in 23 x 4-inch chassis), cable management and advanced functionality.

This 23" chassis (8" high) has BNC connectors and pin jacks. It holds up to 48 modules

Build versatility, efficiency and reliability into your network with the Broadband Connectivity System II (BCS II), Telect's unique modular solution for DS3 connectivity. The cost-effective BCS II offers the optimum blend of high density (up to 32 T3/E3s in 23 x 4-inch chassis), cable management and advanced functionality.

Telect's DSX-3 modules and chassis provide a central location for cross-connecting, monitoring, and testing DS3 circuits. Each DSX-3 chassis includes all necessary hardware for proper installation, including complete cable management. All chassis will mount into standard EIA or WECO relay racks.

Telect's DSX-3 modules and chassis provide a central location for cross-connecting, monitoring, and testing DS3 circuits. Each DSX-3 chassis includes all necessary hardware for proper installation, including complete cable management. All chassis will mount into standard EIA or WECO relay racks.

Telect's DSX-3 modules and chassis provide a central location for cross-connecting, monitoring, and testing DS3 circuits. Each DSX-3 chassis includes all necessary hardware for proper installation, including complete cable management. All chassis will mount into standard EIA or WECO relay racks.

Telect's DSX-3 modules and chassis provide a central location for cross-connecting, monitoring, and testing DS3 circuits. Each DSX-3 chassis includes all necessary hardware for proper installation, including complete cable management. All chassis will mount into standard EIA or WECO relay racks.